What chips are used in the X3 and X6 series X-Headstages?

What chips are used in the X3 and X6 series X-Headstages?

The X3- and X6- X-Headstages are performance-tuned headstages based on Intan Technologies ASIC. KONTEX leverages advanced chip packaging technologies to pack multiple ICs in each chip. Specifically, here are the actual compositions:

  • X3R32 - 1 RHD2132

  • X3R64 - 2 RHD2132

  • X3SR32 - 2 RHS2116

  • X6R128 - 2 RHD2164

Thus, when you plug in the X-Headstage to some of the Open Source applications, you might see multiple chips in the GUI.


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