How is X-Headstage different than Intan's RHD-/RHS-2000 chips?
The X-Headstage features a KONTEX-designed chip package based on Intan's frontend ASICs. Our chip package enables multi-die integration and SiP class interposer technology to route IOs across the top and the bottom of the chip. This enables more efficient integration of components and allows us to achieve an ultra-small headstage that has improved functionalities (i.e., more channels) while maintaining the proven acquisition performance of the Intan chips.