3D print the X-Headstages

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• What chips are used in the X3 and X6 series X-Headstages?

  The X3- and X6- X-Headstages are performance-tuned headstages based on Intan Technologies ASIC. KONTEX leverages advanced chip packaging technologies to pack multiple ICs in each chip. Specifically, here are the actual compositions: X3R32 - 1 RHD2132 ...

• How is X-Headstage more cost-effective than headstages offered by other vendors?

  The X-Headstage is a better headstage solution. It is super small and supported by a wide variety of accessories for more flexible surgery. It can transform passive probes into an active design, offering better noise rejection and signal acquisition ...

• What is the difference between X3R32/64, X3SR, and X6R128 headstages?

  The X3R32/64 is a recording-only headstage with a base footprint of about 8.5x8.5mm and includes a built-in accelerometer. The X3SR32 is the stim-record headstage, with a base footprint of about 8.5x8.5mm. The SR X-Headstages do not support ...

• How to access the ground and reference inputs of the X-Headstages?

  The X-Headstage has GND and REF inputs in the board-to-board connectors. The external pads are omitted to maintain a minimal footprint. Access to these signals can be found on the EIB or the probe.

• Selecting and Configuring the X-Headstage

  Currently, KONTEX offers several types of X-Headstages X3R32: 32ch recording headstage X3R64: 64ch recording headstage XeR64: e-series 64ch recording headstage XeSR16: e-series 16ch switchable stimulation + recording headstage XeSR32: e-series 32ch ...