Articles on: X-Headstage

What chips are used in the X3 and X6 series X-Headstages?

The X3- and X6- series X-Headstages are based on Intan Technologies ASIC. KonteX leverage advanced chip packaging technologies to pack multiple ICs in each chip. Specifically, here are the actual compositions:

X3R32 - 1 RHD2132
X3R64 - 2 RHD2132
X3SR32 - 2 RHS2116
X6R128 - 2 RHD2164

Thus, when you plugin the X-Headstage to some of the Open Source applications, you might see multiple chips showing up in the GUI.

Updated on: 14/02/2023

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