Articles on: X-Headstage

Notes on X3SR headstage pinout

X-Headstage is manufactured based on advanced packaging technology such that there are multiple ICs inside each chip. X3SR32 has two Intan RHS2116 dies inside therefore each die is connected to one of the two X3BtB connectors (in order to maintain the compatibility with other X3 series chips). Therefore only 16 out of 32ch (34ch if including GND and Ref) are activated. The pin out map is as following and other related resource files can be found on the product page:

Updated on: 04/11/2022

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